Tham khảo tài liệu 'the materials science of coatings and substrates part 9', kỹ thuật - công nghệ, cơ khí - chế tạo máy phục vụ nhu cầu học tập, nghiên cứu và làm việc hiệu quả | Table 1 Effects of Organic Addition Agents on Strength and Ductility of Nickel Deposits Ultimate Tensile Strength Yield Strength Tvoe of Elonnat Agent Solution osi psi percent None Fluoborate 74 500 52 700 Saccharin 1 g 1 Ditto 203 000 120 000 None Sulfamate 80 000 50 000 8 Naphthalene trisulfonic acid 8 g l Ditto 140 000 110 000 Naphthalene trisulfonic acid g l and 1 g l coumarin Ditto 170 000 140 000 None Sulfamate 110 000 70 000 7 Naphthalene trisulfonic acid 8 g l Ditto 150 000 110 000 Dibenzene sulfonic acid g l Sulfamate 75 500 12 None Sulfate 87 500 - Trisulfonated naphthalene g l Ditto 250 000 - Trisulfonated naphthalene g l Ditto 140 000 - None Watts 56 000 28 Nickel benzene sulfonate g l and triamine tolylphenyl methane Ditto 212 000 chloride 5-10 mg l From Reference 21. Additives 5 202 Electrodeposition Plating parameter Range Cu2 20 - 25 g L pH - NH4 oh 2-16 mL L Additive 0-4 mL L Current density 23 - 65 amp ft2 I Ultimata tensile strength MPa Figure 2 Effect of plating parameters on the tensile properties of pyrophosphate copper deposits. Adapted from reference 22. Figure 3 Tensile properties and morphology of annealed pyrophosphate copper deposits versus additive concentfation. From reference 28. Reprinted with permission of The Journal of Applied Electrochemistry. Additives 203 levels to cm3dm 3 the ductility again decreases presumably because of inclusion of excessive additive in the deposit Fig. 3j . INFLUENCE ON LEVELING Normal elecưodeposition accentuates roughness by putting more deposit on the peaks than in the valleys of a plated surface since the cuưent density is highest at the peaks because the electric field sưength is greatest in this region. In order to produce a smooth and shiny surface more metal has to be deposited in the valleys than on the peaks which is the opposite of the normal effect. The function of certain organic compounds is to produce this leveling in plating .
