Đang chuẩn bị liên kết để tải về tài liệu:
Three-Dimensional Integration and Modeling Part 4

Không đóng trình duyệt đến khi xuất hiện nút TẢI XUỐNG Tải xuống

Tham khảo tài liệu 'three-dimensional integration and modeling part 4', kỹ thuật - công nghệ, cơ khí - chế tạo máy phục vụ nhu cầu học tập, nghiên cứu và làm việc hiệu quả | THREE-DIMENSIONAL PACKAGING IN MULTILAYER ORGANIC SUBSTRATES 21 FIGURE 3.10 Gain measurement of the Hittite HMC342 13-25 GHz LNA. The first measurement was of the packaged bonded MMIC. The second measurement was done immediately after the packaged MMIC was submerged in water on edge for 48 h. The match of the measurements demonstrates as successful seal by the LCP package. The minimal water absorption into the package shows no significant effect on the MMIC performance. The gain measurement in the before after states is identical indicating that the multilayer LCP MMIC package method can be used successfully for packaging active devices. 3.4 THREE-DIMENSIONAL PAPER-BASED MODULES FOR RFID SENSING APPLICATIONS As the demand for low-cost flexible and efficient electronics increases the materials and integration technologies become more critical and face many challenges especially with the ever growing interest for cognitive intelligence and wireless applications such as radio frequency identification RFID and wireless local area networks WLAN . Paper has been considered as one of the best organic-substrate candidates for ultrahigh frequency UHF and microwave applications such as RFID sensing. It is not only environmentally friendly but can also undergo large reel-to-reel processing. In terms of mass production and increased demand this makes paper the lowest cost material made. Paper also has low surface profile with appropriate coating. This is very crucial since fast printing processes such as direct write methodologies can be utilized instead of metal etching techniques. A fast process like inkjet printing can be used efficiently to print electronics on in paper substrates. 22 THREE-DIMENSIONAL INTEGRATION FIGURE 3.11 Inductively coupled feeding RFID tag module configuration. First of all the RF characteristics of the paper-based substrate have been recently studied by using the cavity resonator method and the transmission line method to characterize the dielectric