Xử lý tối ưu hóa chất bán dẫn thiết bị là một nhiệm vụ phức tạp vì số lượng lớn các khía cạnh đóng góp- ute để toàn bộ. Đầu tiên nó là cần thiết để chuẩn bị và quá trình và vật liệu mỏng bộ phim, điển hình là trong một môi plasma phức tạp ronment. | Dr. Jozef Brcka performs modeling to assist in the development of metal containing high-density plasmas utilized for submicron and nanotechnology applications. Figure 1 Process for surface preparation and cleaning of silicon wafers using hydrogen. Finding the one solution for multiscale multiphysics modeling in wafer processing BY DR. J. BRCKA TEL TECHNOLOGY CENTER ALBANY NY Semiconductor wafer manufacturing involves a large number of processes and the corresponding physics range in size from meters to nanometers. The search for one integrated environment that could handle them all led to COMSOL Multiphysics. Optimizing semiconductor processing equipment is a complex task because of the large number of aspects that contribute to the whole. First it is necessary to prepare and process materials and thin films typically in a complex plasma environment. Next manufacturers deal with flowing and reacting gas mixtures where it is vital to account for static or RF electromagnetic fields and their couplings to the processing media. A wafer fab repre sents a true multiscale problem because the reactors in which the wafers are placed can be more than a meter wide whereas you must account for molecular activity happening in the nanometer range. Further time scales of interest can range from milliseconds to hours. In the past the design of chip manufacturing and processing equipment depended mostly on empirical methods due not only to the rapid pace of innovation but also to the incomplete understanding of the fundamental physical and chemical phenomena. Dedicated codes have been developed at universities but they require users to master their specifics and they also often use simplified geometries or analytical approach models. Yet without adequate modeling finding a part that does the job exactly as required under complex chemistry environments heat or electromagnetic field loads and with predicted actual impact on process performance is primarily trial and error. Not only .
