Tuyển tập báo cáo các nghiên cứu khoa học quốc tế ngành hóa học dành cho các bạn yêu hóa học tham khảo đề tài: Coping with disassembly yield uncertainty in remanufacturing using sensor embedded products | Journal of Remanufacturing SpringerOpen0 This Provisional PDF corresponds to the article as it appeared upon acceptance. Fully formatted PDF and full text HTML versions will be made available soon. Coping with disassembly yield uncertainty in remanufacturing using sensor embedded prOducts Journal of Remanufacturing 2011 1 7 doi 2210-4690-1-7 Mehmet Ali Ilgin Surendra M. Gupta gupta@ Kenichi Nakashima nakasima@ ISSN 2210-4690 Article type Research Submission date 13 February 2011 Acceptance date 12 December 2011 Publication date 12 December 2011 Article URL http content 1 1 7 This peer-reviewed article was published immediately upon acceptance. It can be downloaded printed and distributed freely for any purposes see copyright notice below . For information about publishing your research in Journal of Remanufacturing go to http authors instructions For information about other SpringerOpen publications go to http 2011 Ilgin etal. licensee Springer. This is an open access article distributed under the terms of the Creative Commons Attribution License http licenses by which permits unrestricted use distribution and reproduction in any medium provided the original work is properly cited. Coping with disassembly yield uncertainty in remanufacturing using sensor embedded products Mehmet Ali Ilgina Surendra M. Guptab and Kenichi Nakashimac a Department of Industrial Engineering Dokuz Eylul University Buca 35160 Izmir Turkey 90-232-4127601 b Laboratory for Responsible Manufacturing 334 SN Department of MIE Northeastern University Boston MA 02115 USA 1-617-3734846 gupta@ c Department of Information and Creation Kanagawa University Yokohama 221-8686 Japan 81-454815661 nakasima@ 1 ABSTRACT This paper proposes and investigates the use of embedding sensors in .
