Báo cáo hóa học: " Formation of silicon nanodots via ion beam sputtering of ultrathin gold thin film coatings on Si"

Tuyển tập báo cáo các nghiên cứu khoa học quốc tế ngành hóa học dành cho các bạn yêu hóa học tham khảo đề tài: Formation of silicon nanodots via ion beam sputtering of ultrathin gold thin film coatings on Si | El-Atwani et al. Nanoscale Research Letters 2011 6 403 http content 6 1 403 o Nanoscale Research Letters a SpringerOpen Journal NANO EXPRESS Open Access Formation of silicon nanodots via ion beam sputtering of ultrathin gold thin film coatings on Si Osman El-Atwani1 2 Sami Ortoleva3 Alex Cimaroli4 and Jean Paul Allain1 2 4 Abstract Ion beam sputtering of ultrathin film Au coatings used as a physical catalyst for self-organization of Si nanostructures has been achieved by tuning the incident particle energy. This approach holds promise as a scalable nanomanufacturing parallel processing alternative to candidate nanolithography techniques. Structures of 11- to 14-nm Si nanodots are formed with normal incidence low-energy Ar ions of 200 eV and fluences above 2 X 1017 cm-2. In situ surface characterization during ion irradiation elucidates early stage ion mixing migration mechanism for nanodot self-organization. In particular the evolution from gold film islands to the formation of ion-induced metastable gold silicide followed by pure Si nanodots formed with no need for impurity seeding. Nanostructuring of semiconductor surfaces via ion beam sputtering has been shown to yield a variety of ordered nanostructures 1-3 . While there is speculation about the mechanism of nanostructure evolution on compound semiconductors the structuring of single-component semiconductor materials and more specifically silicon remains elusive. Although structuring of silicon surfaces using ion beam bombardment at normal incidence was first reported by R. Gago et al. 4 studies later on have shown that structuring of silicon dots on silicon surfaces at zero incidence angle is possible only if a certain level of impurity is available on the surface during the sputtering process 5 . Moreoever other studies have shown that irradiating silicon surfaces with no impurity seeding results in surface smoothing at normal incidence 6 7 in contradiction to the results of R. Gago .

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