Tuyển tập báo cáo các nghiên cứu khoa học quốc tế ngành hóa học dành cho các bạn yêu hóa học tham khảo đề tài: An Organic Metal/Silver Nanoparticle Finish on Copper for Efficient Passivation and Solderability Preservation | Nanoscale Res Lett 2007 2 455-460 DOI S11671-007-9086-0 NANO EXPRESS An Organic Metal Silver Nanoparticle Finish on Copper for Efficient Passivation and Solderability Preservation Bernhard Wessling Marco Thun Carmen Arribas-Sanchez Sussane Gleeson Joerg Posdorfer Melanie Rischka Bjoern Zeysing Received 28 July 2007 Accepted 10 August 2007 Published online 29 August 2007 to the authors 2007 Abstract For the first time a complex formed by polyaniline in its organic metal form and silver has been deposited on copper in nanoparticulate form. When depositing on Cu pads of printed circuit boards it efficiently protects against oxidation and preserves its solderability. The deposited layer has a thickness of only nominally 50 nm containing the Organic Metal conductive polymer polyaniline and silver. With 90 by volume polyaniline PAni is the major component of the deposited layer Ag is present equivalent to a 4 nm thickness. The Pani-Ag complex is deposited on Cu in form of about 100 nm small particles. Morphology electrochemical characteristics anti-oxidation and solderability results are reported. Keywords Conductive polymer Organic metal Nanoparticle Cu passivation Printed circuit board soldering Introduction Polyaniline is known as a conductive polymer and object of intensive studies for many years 1-4 . Especially the possibility of forming nanofibres from PAni has motivated many researchers 5 6 . The fact that PAni primarily exists in form of about 10 nm small nanoparticles 7 is less well known and has not inspired too much additional research B. Wessling El M. Thun C. Arribas-Sanchez S. Gleeson J. Posdorfer M. Rischka B. Zeysing Ormecon GmbH Ferdinand-Harten-Str. 7 Ammersbek 22949 Germany e-mail Wessling@ work outside our labs. The same holds for the possibility to improve the electronic transport properties of PAni by dispersion which allows under appropriate conditions PAni to cross the insulator-to-metal transition and become a true metal .
