Most manufacturing technologies for metallic microstructures have their roots either in semiconductor (inmost cases, silicon) device production or in conventional precision machining. Of these, the techniques that are well known have been used formicrostructure dimensions. Further, they have been adapted and improved to reach the desired precision and surface quality. In some rare cases, itwas possible to use the same manufacturing process for macroscale and microscale devices and to get the desired results. Inmost of the cases, substantial changes in the design of the device, themethodology of the process and themanufacturing process itself were more or less necessary to provide the accuracy and quality needed for microstructure devices suitable.
