Although assembling of a number of device parts is not really a problem in the macroscaleworld, it needs to be delicately handled in themicroscaleworld. Themain point is the adjustment and alignment accuracy of the parts. Moreover, problems of sealing, fixation and bonding technology may also occur depending on the material and the parameters of the designated process of the on the surface quality and the bonding technology applied, aligning errors may reach similar dimensions compared to themicrostructure itself. An example of the same is shown in Figure . Here, a number of wet chemically etched microstructure foils have been aligned in a poor way to form elliptically.
