Thus, special attention has to be paid to burr microstructures or to avoid burr formation. Itmight even be necessary to apply special techniques such as electropolishing to burr the single parts. microstructures are welding (laser, e-beam, etc.), brazing, diffusion bonding and low- temperature aswell as high-temperature soldering. Even clamping and sometimes, for very specific applications, gluing, including different sealing techniques,might be the other options. Details of the processes can be found in Refs
