Evaluation of interfacial toughness function in mixed mode loading

Interfacial strength is one of important factors to affect working stability of structures and devices. In order to avoid interfacial cracking, an improved method based on the conventional one is proposed to establish the interfacial toughness function (or the set of the interfacial fracture criteria in mixed-mode loading). By preliminarily analyzing the Brazil nut specimen, the placements of applied load, where pure modes I and II occurred, were determined. | Vietnam Journal of Mechanics, VAST, Vol. 34, No. 2 (2012), pp. 101 – 112 EVALUATION OF INTERFACIAL TOUGHNESS FUNCTION IN MIXED MODE LOADING Do Van Truong, Vuong Van Thanh Hanoi University of Science and Technology, Vietnam Abstract. Interfacial strength is one of important factors to affect working stability of structures and devices. In order to avoid interfacial cracking, an improved method based on the conventional one is proposed to establish the interfacial toughness function (or the set of the interfacial fracture criteria in mixed-mode loading). By preliminarily analyzing the Brazil nut specimen, the placements of applied load, where pure modes I and II occurred, were determined. Experiment was then conducted on the specimens at the pre-determined placements of applied load. The interfacial toughness function was finally established by an empirical function based on only the critical energy release rates at pure modes I and II. The results showed that the interfacial toughness function was close to that obtained by experimental data and other researches. Key words: Interface toughness, fracture criteria, interface crack, bi - material. 1. INTRODUCTION Adhesively bonded joint has been employed in many industries, especially in micro/nano electronic and aerospace industries, due to its advantages such as small, light structure and use of fewer details. The joint can be created by two main methods as the indirect method and the direct method depending on its application and size scale. For material layers in supermicron-scale, the joint is usually formed from two surfaces adhered together by a bonding agent as heat and pressure, while the joint of material layers in submicron-scale is directly formed by evaporating or sputtering the atoms of a source material on the surface of a substrate material. The adhesion strength of formed interface depends on component material layers, surface quality and joint angle between material layers as well as fabrication .

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