In this paper, maximum tangential stress (MTS) concept is used for determination of the fracture initiation angles of silicon/ glass bi-material notches. First, the MTS criterion is analytically formulated for a bi-material notch problem. | Application of maximum tangential stress criterion in determination of fracture initiation angles of silicon glass anodic bonds Engineering Solid Mechanics 2 2014 145-150 Contents lists available at GrowingScience Engineering Solid Mechanics homepage esm Application of maximum tangential stress criterion in determination of fracture initiation angles of silicon glass anodic bonds . Mirsayara and A. T. Samaeib a Zachry Department of Civil Engineering Texas A amp M University College Station TX 77843-3136 USA b Young Researchers amp Elite Club Chalous Branch Islamic Azad University Chalous Iran ARTICLE INFO ABSTRACT Article history Silicon glass bi-materials are used in micro-assembly and packaging of micro- Received January 25 2014 electromechanical systems MEMS and micro-electronics devices. In this paper maximum Received in Revised form tangential stress MTS concept is used for determination of the fracture initiation angles of May 10 2014 silicon glass bi-material notches. First the MTS criterion is analytically formulated for a bi- Accepted 7 June 2014 Available online material notch problem. Then the criterion used for prediction of fracture initiation angles of 9 June 2014 some experimental data given in literature for silicon glass bi-material notches. In addition the Keywords modified MTS MMTS criterion which considers the effect of I-stress was compared with the Bi-material notches MTS criterion and the experimental data. It was shown that MMTS criterion provides more Maximum tangential stress accurate results than the MTS criterion for estimation of the fracture initiation angle. Fracture initiation angle Silicon glass anodic bonds 2014 Growing Science Ltd. All rights reserved. 1. Introduction Nowadays bi-material notches can be seen in different modern industrial structures such as aircrafts automobiles and microelectronics structures. Among them the use of micro- electromechanical systems MEMS and micro-electronics devices is
