The results provided a detailed understanding of thermal behavior of a single LED module and established a crucial insight into thermal management design for high-power white LED lamp. Thermal-interface-materials (TIM) and the dielectric layer are proposed to have thermal conductivity around 1 W/mK for system optimization. In addition, based on the thermal analysis of heat sink, we have proposed and investigated a new configuration of plastic heat sink embedded with aluminum-alloy. The thickness ratio between the embedded aluminum layer and the heatsink base is suggested to be around to for the optimal configuration. |
