The results showed that Pt particles, deposited by dc-magnetron gun, surround the large Co-clusters deposited by rf-magnetron gun. In addition, the increase of Co content led to an increase in the electrochemical active surface area (EASA) from m2 /gPt to m2 /gPt for pure Pt and Pt:Co (1:3), respectively, which corresponded the improvement of the utilization of Pt by a factor of . This improvement indicated that the sequential magnetron cosputtering was one of the essential technique to deposit homogeneous metal clusters with desirable size on the gas diffusion layer by adjustment plasma parameters. |
