The molecular dynamic simulation has been conducted to study the behavior of void and void clusters in liquid silica under temperature. We focused on two kinds of void aggregation: void cluster and void tube. The evolution of structural changes of silica under temperature has been analyzed through coordination number, angle distribution and void characteristics. It was found that there is a large void tube composed of 91% O-void spread over simulation shell. The temperature dependence of different kinds of void seems to be very week in comparison with pressure. |
