Tham khảo tài liệu 'three-dimensional integration and modeling part 1', kỹ thuật - công nghệ, cơ khí - chế tạo máy phục vụ nhu cầu học tập, nghiên cứu và làm việc hiệu quả | Three-Dimensional Integration and Modeling A Revolution in RF and Wireless Packaging v Contents 1. 2. Background on Technologies for Millimeter-Wave Passive Front-Ends .5 3D Integrated SOP Concept .5 LTCC Multilayer 60 GHz Transmitter Receiver Modules .8 3. Three-Dimensional Packaging in Multilayer Organic Substrates .11 Multilayer LCP Substrates .11 RF MEMS Packaging Using Multilayer LCP Package RF MEMS Switch Performance with Packaged Transmission Lines with Package Active Device Packaging Using Multilayer LCP Embedded MMIC MMIC Package MMIC Package Three-Dimensional Paper-Based Modules for RFID Sensing 4. Microstrip-Type Integrated Passives .23 Patch Resonator Filters and Single Patch Three and Five-Pole Resonator Quasielliptic 5. Cavity-Type Integrated Passives .37 Rectangular Cavity Resonator .37 Three-Pole Cavity Vertically Stacked Cavity Filters and Design of Cavity Design of Three-Pole Cavity Bandpass vi THREE-DIMENSIONAL INTEGRATION Cavity-Based Dual-Mode Dual-Mode Cavity Single Dual-Mode Cavity Internal External Coupling .59 Transmission Quasi-Elliptic Dual-Mode Cavity Multipole Dual-Mode Cavity Quasi-Elliptic Filter with a Rectangular Quasi-Elliptic Filter with a Cross Slot .72 6. Three-Dimensional Antenna Architectures .73 Patch Antenna Using a Soft-Surface Investigation of an Ideal Compact Soft Surface Implementation of the Soft-Surface Structure in High-Gain Patch Antenna Using
