Tham khảo tài liệu 'three-dimensional integration and modeling part 2', kỹ thuật - công nghệ, cơ khí - chế tạo máy phục vụ nhu cầu học tập, nghiên cứu và làm việc hiệu quả | 1 CHAPTER 1 INTRODUCTION The rapid growth of wireless local area and personal communication networks as well as sensor applications has led to a dramatic increase of interest in the regimes of radio frequency RF microwave millimeter-wave systems 1 . The 60 GHz band is of much interest as it is the band in which massive amounts of spectrum space 7 GHz have been allocated worldwide for ultrafast wireless local communications 2 . There are a number of multimedia applications for short-range communications such as high-speed Internet access video streaming content downloads and wireless data bus for cable replacement 3 . Such emerging applications with data rate greater than 2 Gb s require real estate efficiency low-cost manufacturing and excellent performance achieved by a high-level of integration of embedded functions 2 . However up to now the band around 60 GHz has been limited in use based on the difficulties associated with traditional radio propagation models and the cost of producing commercial products. Since the mid-1990s many examples of monolithic-integrated circuit MMIC chipset have been reported for 60 GHz radio applications using gallium arsenide GaAs field effect transistor FET indium phosphide InP and pseudomorphic high electron mobility transistor pHEMT technologies 2 . Despite their commercial availability and their outstanding performance these technologies struggle to enter the market because of their prohibitive cost and their limited capability to integrated advanced baseband processing. The combination of a low-cost highly producible module technology featuring low loss and embedded miniaturized passive functions is required to enable a commercial use of the 60 GHz systems. Considering the importance of the above-mentioned new applications at 60 GHz a paradigm change in the system integration of millimeter-wave applications from high budgets and low volumes toward low costs and high-volumes is underway. With respect to millimeter-wave front-end
