Tham khảo tài liệu 'an introduction to mems engineering - nadim maluf and kirt williams part 15', kỹ thuật - công nghệ, cơ khí - chế tạo máy phục vụ nhu cầu học tập, nghiên cứu và làm việc hiệu quả | Glossary Accelerated life testing Also known as accelerated ageing it is a methodology in reliability that subjects a product to a high degree of operational and environmental stresses such as high temperature or voltage in order to precipitate failure modes that would normally manifest themselves in later stages of the product s life. Action potential A temporary change in the electrical voltage across the cellular membrane of a nerve or muscle cell. Action potentials occur when the cell is stimulated especially by a nerve impulse. They form the mechanism by which sensory and motor functions are transmitted across the neural system. Amorphous silicon Silicon lacking a preferred crystalline orientation typically consisting of extremely fine grains each measuring a few nanometers in size. Amplification In biochemistry it is the process of making a large number of identical copies of a DNA fragment. In electronics it is the process of increasing the magnitude of an electrical voltage. Anodic bonding A process to bond silicon to glass specifically Pyrex 7740 or equivalent. Application-specific integrated circuit ASIC An electronic integrated circuit with a functionality designed specifically for one particular application . the detection of minute changes in capacitance and conversion into an output voltage . Bandpass see filter. Bandwidth The extent of the frequency response of a linear system. It is numerically defined as the difference between two corner frequencies where the system gain is 3 dB below the maximal gain. An input signal with a frequency content below or above the corner frequencies is severely attenuated by the system. Bimetallic actuation The resulting motion when a stack of two materials having dissimilar coefficients of thermal expansion is heated. One material expands more than the other giving rise to bending stresses. The amount of bending is proportional to the temperature of the stack and the difference in coefficients of thermal .
