Tham khảo tài liệu 'the mems handbook mems applications (2nd ed) - m. gad el hak episode 1 part 2', kỹ thuật - công nghệ, cơ khí - chế tạo máy phục vụ nhu cầu học tập, nghiên cứu và làm việc hiệu quả | a b COLOR FIGURE Examples of two high-volume accelerometer products. Example a is the top view micrograph of the Analog Devices Inc. ADXL250 two-axis lateral monolithically-integrated accelerometer. Example b is a perspective view of the Freescale Semiconductor Inc. wafer-scale packaged accelerometer and control chips stackmounted on a lead frame prior to plastic injection molding. Photos courtesy of Analog Devices Inc. and Freescale Semiconductor Inc. COLOR FIGURE Top view micrograph of a Z-axis accelerometer quadrant showing a folded spring and sacrificial etch holes designed into the proof-mass structure. Photo courtesy Freescale Semiconductor Inc. 2006 by Taylor Francis Group LLC COLOR FIGURE The frequency response x versus normalized frequency ratio O 0. CMOS Device area Micromechanical device area poly stud eld oxide COLOR FIGURE Cross-sectional diagram of the IMEMS process developed at Sandia National Laboratories demonstrating the transducer formed in a recessed moat and sealed prior to the commencement of the high density CMOS process. Photo courtesy Sandia National Laboratories. 2006 by Taylor Francis Group LLC COLOR FIGURE Top view micrograph of a Z-axis capacitive accelerometer in three polysilicon layers. The design allows for high inertial sensitivity with a low temperature sensitivity. Photo courtesy Freescale Semiconductor Inc. F F r w COLOR FIGURE Stress concentrations for a flat plate loaded axially with two different widths and fillet radius r. The maximum stress is located around the fillets. 2006 by Taylor Francis Group .
