Tham khảo tài liệu 'mems and microstructures in aerospace applications - robert osiander et al (eds) part 15', kỹ thuật - công nghệ, cơ khí - chế tạo máy phục vụ nhu cầu học tập, nghiên cứu và làm việc hiệu quả | Microelectromechanical Systems and Microstructures in Aerospace 349 excluding government laboratories such as Sandia National Laboratory have been developed to produce MEMS solely for commercial and terrestrial applications. This chapter will emphasize the noncommercial high volume environment and assumes that production runs will be an iterative process using prototypes and small wafer runs. Therefore the focus will be on custom and prototype activity. Tailoring of Test Plans As a small volume custom-type activity test plans are expected to modify or supplement standard test plans. These tailoring activities should have the following attributes It should be a standard methodology not necessarily a standard test. It should be concurrent with other engineering activities not a final pass or fail gate. It should be easily applicable to a given design rather than being a standard test. It should be easily portable across processes not requiring reinitialization of all steps taken to date. It should be quick and inexpensive not requiring months of the design process and tens of thousands of dollars. It should be based on understanding of reliability not the lack of it. It should be based on all data sources not just a single qualification test. An example of reliability testing that uses the above principles is product testing at Analog Devices Inc. A series of mechanical tests confirm resistance to mechanical shock stiction and other MEMS-specific failure modes. These reliability tests can be applied at the technology component or system level 3 but all fundamentally depend on the interactions of MEMS parts at their most basic level. The test conditions used in these reliability tests use MIL-STD-883 Test Methods for Microcircuits as the base. MIL-STD-883 is a widely used and accepted document for prescribing test methodology. These MIL-STD-883 tests include High-temperature operating life HTOL at condition C Temperature cycle condition C Thermal shock .
