Misalign- ment will lead to non-regular channels and thereforemay interfere with the bonding technique; in severe cases, it may lead to the destruction of the complete device. A correct alignment will lead to only small deviations fromthe desired elliptical shape, and the distortion while the bonding process takes place will be minimum. Align- ment techniques used to avoid errors can be simplemechanicalmethods (. use of alignment pins), edge catches in a specially designed assembling device or optical methods such as laser alignment. These methods are easily automated as shown in the semiconductor technology. In fact, most of the methods come from silicon processing technology where precise alignment ofmultiplemask layers.
