Ebook "Three-dimensional integration of semiconductors: Processing, materials, and applications" reviews the state of the art of three-dimensional semiconductor integration. Chapter 1 gives an overview of three-dimensional integration research and development history. Chapter 2 summarizes recent three-dimensional integration research and development activities and applications. Chapter 3 gives an explanation of through-silicon via (TSV) formation processes. Chapters 4 and 5 cover wafer handling, wafer thinning, and bonding of wafers and dies. Chapter 6 explains metrology and inspection. |
