Almost all technologies described so far are suitable for prototyping or for small series production only. It simply takes a lot of time and is therefore costly to manufacture a large number of microstructures by laser ablation or wire erosion and by milling or SLM. This is not so in the case of the etching techniques. Here, a large number of microstructure devices can be very easily generated. Another possibility to obtain a large number of microstructures is by embossing. As it was shown [19], even microstructures ranging down to a few 10 mm structure size can be easily realized with embossing technology. For embossing, a tool providing.