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PCB Stack-up Overview for Intel Architecture Platforms

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Ví dụ được đưa ra với các bức ảnh cho các phong cách khác nhau của khớp nối, chẳng hạn như các loại thiết bị, đàn hồi và flex-pack. Chấp nhận sự liên kết được xác định ngay lập tức mà không cần tính toán phức tạp hình học là cần thiết với các phương pháp khác. Các thiết bị đo lường sự liên kết không chỉ là không tốn kém | intel Keith Edwards CAD Engineering Manager Vira Ragavassamy Signal Integrity Engineer Intel Corporation PCB Stack-up Overview for Intel Architecture Platforms Layout and Signal Integrity Considerations December 2008 321077 1 iniei PCB stack-up overview for Intel Architecture Platforms Executive Summary Designing a proper stack-up is critical to achieve the lowest cost and highest reliability PCB design. This is getting increasingly more difficult as high speed digital design is getting more complex. A stack-up refers to the arrangement of the copper and insulating layers that make up a Printed Circuit Board PCB . The stack-up must consider several job functions to ensure success. A collaborative effort between the layout signal integrity hardware engineer and manufacturing fabrication assembly vendor is key to ensuring that all parameters are met and incorporated into the stack-up. It is critical that the stack-up is generated and agreed upon by all parties early in the design phase. This ensures that each discipline knows what the final layout will entail and prevents any issues during the critical layout phase of a design. It is strongly recommended to follow the associated Platform Design Guide PDG whenever possible. A collaborative effort between the layout signal integrity hardware engineer and manufacturing fabrication assembly vendor is key to ensuring that all parameters are met and incorporated into the stack-up. There are numerous items to consider in determining the best stack-up for a specific design. These items include the following PCB Material o Use standard fiberglass epoxy-resin or flame retardant 4 FR4 material when possible. Alternate materials may be needed 2 321077 PCB Stack-up Overview for Intel Architecture Platforms depending on the design however there may be a significant cost adder when selecting certain materials. o Restriction of Hazardous Substances RoHS and halogen-free compliance o Material availability from vendor to vendor may .