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Bishop, Robert H. - The Mechatronics Handbook [CRC Press 2002] Part 9

Tham khảo tài liệu 'bishop, robert h. - the mechatronics handbook [crc press 2002] part 9', kỹ thuật - công nghệ, cơ khí - chế tạo máy phục vụ nhu cầu học tập, nghiên cứu và làm việc hiệu quả | FIGURE 20.59 The shunt-wound motor load characteristics. Torque FIGURE 20.60 The shunt-wound torque-speed characteristics. FIGURE 20.61 The series-wound motor. suggests that the speed-armature current characteristic will take the form of a hyperbola. Similarly Eq. 20.25 indicates that the torque-armature current characteristic will be approximately parabolic. These general characteristics are illustrated in Fig. 20.62 along with the derived torque-speed characteristic in Fig. 20.63. The general characteristics indicate that if the load falls to a particularly low value 2002 CRC Press LLC FIGURE 20.59 FIGURE 20.60 FIGURE 20.61 The shunt-wound motor load characteristics. Torque The shunt-wound torque-speed characteristics. The series-wound motor. suggests that the speed-armature current characteristic will take the form of a hyperbola. Similarly Eq. 20.25 indicates that the torque-armature current characteristic will be approximately parabolic. These general characteristics are illustrated in Fig. 20.62 along with the derived torque-speed characteristic in Fig. 20.63. The general characteristics indicate that if the load falls to a particularly low value 2002 CRC Press LLC theory and mechanics comprise the fundamentals for analysis modeling simulation design and optimization while fabrication is based on the micromachining and high-aspect-ratio techniques and processes which are the extension of the CMOS technologies developed to fabricate ICs. For many years the developments in microelectromechanical systems MEMS have been concentrated on the fabrication of microstructures adopting modifying and redesigning silicon-based processes and technologies commonly used in integrated microelectronics. The reason for refining of conventional processes and technologies as well as application of new materials is simple in general microstructures are threedimensional with high aspect ratios and large structural heights in contrast to two-dimensional planar microelectronic .