Đang chuẩn bị liên kết để tải về tài liệu:
MEMS Mechanical Sensors - Stephen Beeby Part 4

Tham khảo tài liệu 'mems mechanical sensors - stephen beeby part 4', kỹ thuật - công nghệ, cơ khí - chế tạo máy phục vụ nhu cầu học tập, nghiên cứu và làm việc hiệu quả | 50 MEMS Simulation and Design Tools the displacement of a beam as a result of an applied voltage giving rise to an attractive electrostatic force. Another solver is the microfluidic analysis module. This tool allows the user to analyze thermal effects concentrations and flow within a fluid. It also simulates velocity and electric field distributions as a result of electrokinetic phenomena. Another very useful tool is AnisE an anisotropic etch process simulator. With AnisE the user can use the layout of the microstructure to be prototyped to view a three-dimensional representation of it access information about the etch rates of different etchants and then simulate the etching under different time temperature and concentration parameters. Finally Intellisense contains a module called 3-D Builder which can be called from any of the solvers or separately as a standalone application. This tool allows for building and meshing the three-dimensional geometry of MEMS structures with a graphical interface. The screen is divided into two areas on the left is the twodimensional layer window where the outline of different layers can be drawn and on the right is the three-dimensional viewing window which allows the user to visualize the device in three dimensions and includes zooming rotating and panning functions. Furthermore the thickness of any layer can be changed. In this way a MEMS device can be created without having to define the full fabrication process flow. The module produces a file that can be used for analysis in any of the solvers or alternatively a mask file that can be processed further by IntelliMask. 3.2.2.3 ANSYS ANSYS Inc. The ANSYS FEA software is a commercially available simulation tool capable of structural vibration modal harmonic and transient thermal acoustic fluidic electromagnetic and piezoelectric analyses or combinations of these . While not specifically written for the simulation of MEMS many of these analyses apply equally well in the .