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Báo cáo hóa học: " Preparation and Characterization of Silica/Polyamide-imide Nanocomposite Thin Films"

Tuyển tập báo cáo các nghiên cứu khoa học quốc tế ngành hóa học dành cho các bạn yêu hóa học tham khảo đề tài: Preparation and Characterization of Silica/Polyamide-imide Nanocomposite Thin Films | Nanoscale Res Lett 2010 5 1846-1851 DOI 10.1007 s11671-010-9726-7 NANO EXPRESS Preparation and Characterization of Silica Polyamide-imide Nanocomposite Thin Films Xiaokun Ma Nam-Hee Lee Hyo-Jin Oh Jong-Sun Hwang Sun-Jae Kim Received 28 June 2010 Accepted 26 July 2010 Published online 7 August 2010 The Author s 2010. This article is published with open access at Springerlink.com Abstract The functional silica polyamide-imide composite films were prepared via simple ultrasonic blending after the silica nanoparticles were modified by cationic surfactant cetyltrimethyl ammonium bromide CTAB . The composite films were characterized by scanning electron microscope SEM thermo gravimetric analysis TGA and thermomechanical analysis TMA . CTAB-modified silica nanoparticles were well dispersed in the polyamide-imide matrix and the amount of silica nanoparticles to PAI was investigated to be from 2 to 10 wt . Especially the coefficients of thermal expansion CET continuously decreased with the amount of silica particles increasing. The high thermal stability and low coefficient of thermal expansion showed that the nanocomposite films can be widely used in the enamel wire industry. Keywords Composites Fracture Surfaces Thermal properties Thin films Introduction Polyamide-imide PAI is a kind of thermoplastic resin has good high-temperature resistance outstanding mechanical properties and excellent oxidative stability all of which X. Ma N.-H. Lee H.-J. Oh S.-J. Kim Institute Faculty of Nanotechnology and Advanced Materials Engineering Sejong University 98 Gunja-dong Gwangjin-gu Seoul 143-747 South Korea e-mail sjkim1@sejong.ac.kr J.-S. Hwang Department of Computer Applied Electricity Jeonnam Provincial College 262 Hyangyo-Ri Damyang-Eup Damyang-Gun Jeonnam 517-802 South Korea have led PAI to have been widely used with electronic materials adhesives composite materials fiber and film material 1-8 . Comparing with the polyimide and polyamide the PAI own the better process ability .