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Thermal simulation and analysis of the single led module

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The results provided a detailed understanding of thermal behavior of a single LED module and established a crucial insight into thermal management design for high-power white LED lamp. Thermal-interface-materials (TIM) and the dielectric layer are proposed to have thermal conductivity around 1 W/mK for system optimization. In addition, based on the thermal analysis of heat sink, we have proposed and investigated a new configuration of plastic heat sink embedded with aluminum-alloy. The thickness ratio between the embedded aluminum layer and the heatsink base is suggested to be around 0.1 to 0.15 for the optimal configuration. |

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