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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 16

Tham khảo tài liệu 'an introduction to mems engineering - nadim maluf and kirt williams part 16', kỹ thuật - công nghệ, cơ khí - chế tạo máy phục vụ nhu cầu học tập, nghiên cứu và làm việc hiệu quả | 280 Index Polymerase chain reaction continued on a chip 174-76 defined 174 Polymers 21 23 defined 23 forms 21 parylenes 23 photoresist 21 polyimide 21 23 Polysilicon 14 17-18 beam structures 18 deposition of 38 importance 17 mechanical properties 17 piezoresistive effect 26 surface micromachining 69-71 Population inversion 143 Potassium hydroxide KOH 16 etch rate 47 as KOH 46 Pressure sensors 89-93 fabrication process 91 high-temperature 93-94 schematic illustration 90 silicon-fusion-bonded 91 See also Sensors Principle axes 15 Protective coatings 222-23 Psychological barrier 8-9 Q Quality control 244-46 Quartz crystals 201 micromachining 21 as piezoelectric material 29 R Reactive ion etching RIE 51-52 Redwood Microsystems valve 120-22 defined 120 fabrication steps 121 illustrated 120 operating mechanism 121 See also Micromachined valves Reliability 243-56 accelerated life modeling 248-49 bath-tub relationship 248 case study 254-56 defined 246 GR-CORE series 245 ISO 9000 QS 9000 244 standards 244-46 statistical methods in 246-48 tests 246 See also Failure s Quality control Resonators 200-211 beam 203-6 comb-drive 201-3 coupled-resonator bandpass filter 206-8 film bulk acoustic 208-11 microelectromechanical 200-211 See also RF MEMS RFMEMS 189-214 devices 189 losses 190 low-resistivity metals 190 microelectromechanical resonators 200-211 microelectromechanical switches 211-14 passive electrical components 190-200 signal integrity 189-90 Room-temperature vulcanizing RTV rubbers 227 252 S Santur DFB tunable laser 148-51 Screen printing 65-66 defined 65 illustrated 65 process 65-66 Seebeck effect 29 30 coefficients 30 defined 29 thermocouple structure using 30 Self-assembled monolayers SAM 61 coating process 61 electromagnetic 82 precursors 61 Sensing capacitive 82 methods 81-82 objective 81 piezoresistive 81-82 Sensors 89-116 acceleration 96-114 angular rate 104-7 carbon monoxide gas 114-16 high-temperature pressure 93-94 mass flow 94-96 pressure 89-93 protective .